F 640
F 640 Solder Paste series is a state-of-the-art lead free no clean solder paste that promotes wetting
and minimises soldering defects. The F 640 flux system is specifically optimised for Sn/Ag/Cu alloy soldering.
Extensive testing at customer locations has proven this paste to be capable of defect-free performance
in the production environment.
The F 640 Series exhibits minimal slump and has excellent print-after-wait performance.
This formula provides superior performance on a variety of surface finishes and leaves behind a clear residue.
Reflow can be accomplished in air or nitrogen.

Key Benefits of F 640:
- exceptional print to print consistency
- excellent wetting
- min. 8 hour tack and work life
- very good print after wait performance
- SIR 85/85 > 10E10 Ohm
- constant performance at 30°C for 7days
- work conditions between 20 and 32°C
- Fulfils Siemens Standard accord. DIN EN 29454 Part 1
- Passes J-STD-004

Datasheet

Technical Information on F 640


For alternative lead free solder pastes click here!



Reference customer lead free Solder Pastes:
"TV set manufacturer Loewe/Germany successfully
moved to lead-free technology"