|
|
|
Semiconductor and Packaging Materials
Product Categories
Conductive Adhesives for
Die Attach
Tantalum Capacitors
Component Attach
Smart Cards
Flexible Circuits
Solder Pastes for
Die Attach
Direct Bonded Copper
Wafer Bumping
Semiconductor Applications
Tack Fluxes for
Ball Attach
Attachment of Bumped Devices
back
© W. C. Heraeus GmbH· Heraeusstr. 12 - 14 · 63450 Hanau, Germany Phone: +49 (0) 61 81 / 35-52 65 · Fax: +49 (0) 61 81 / 35-78 60 E-Mail: cmdinfo@heraeus.com · Internet: www.4cmd.com |