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Back to Home Specific Requirements of Conductive Adhesives 1. Component availability 2. Component surface and carrier preferred component surfaces: Ag/Pd, Ag/Pt, Ag preferred carrier surfaces: chem. Pd, Au, Ag, Ni/Au, Cu-Entec, PbSn, Sn 3. Component and layout geometry Component: intensely restricted through technology and manufacturer's defaults Carrier: optimization of the adhesive pads needed to benefit component attachment. One must ensure that the adhesive surrounds the pads of the component. 4. Production technology Placement strictness: correct thickness / plane-parrallel to the carrier / in the given position © W. C. Heraeus GmbH· Heraeusstr. 12 - 14 · 63450 Hanau, Germany Phone: +49 (0) 61 81 / 35-52 65 · Fax: +49 (0) 61 81 / 35-78 60 E-Mail: cmdinfo@heraeus.com · Internet: www.4cmd.com