PD 966 M
SMT-Adhesive with extremely wide processing window
Heraeus recently introduced a new thermosetting polymer SMT adhesive, which is designed for ultra-high-speed dispensing. Other particular features are: capability for dispensing with extremely low Z-height return (the height above the board that the dispense head will retract to upon completion of the dispense cycle) ; high adhesion properties with standard and also with difficult-to-glue components (e.g. low stress encapsulants); low humidity absorption and very high surface insulation resistance for in situ reliability.

PD 966 M is a single-component, solvent-free, epoxy based adhesive developed especially for the surface mounting of SMT components on to PCBs and for use on bare substrates. Trials with fastest machines on the market have been successfully completed with no stringing phenomena observed. Tests were performed both on Overhead Pressure systems and on Archimedes Screw technology.

The remarkable feature of PD 966 M is extremely wide dispensing processing window. Small and medium sized dots (e.g. for 0603, 0805, 1206, SOT23 small melf) can be dispensed with the Z-height return of only 2 mm without any stringing. For larger dots (e.g. for 1812, large melf, SO8, PLCC44, QFP199) the Z-height return of 4 mm is sufficient to get perfect dots.
Although the viscosity behaviour is optimized for ultra-high-speed dispensing, the glue dot form is stable and does not slump. The adhesive can easily be removed before curing with a variety of water and solvent based cleaning mediums. Due to a residual thermoplasticity, the replacement of defective components by spot heating is possible. The well-studied formulation, and many years of experience in the production of SMT adhesive, guarantee constant batch-to-batch quality.

PD 966 M is available in a large number of syringes for different dispensing machines.



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