No-Clean Solder Pastes

No-Clean Solder Pastes
The flux residues of no clean solder pastes are inert after reflow and may remain on the surface of a board without need for cleaning. They do not cause long term corrosion or alter surface resistance during the lifetime of a board.
The users should set up their own no-clean specifications and test criteria, depending on the final application of the boards.

Shelflife of product
Requirements for the product concerning
	Temperature, shock temperature, change of temperature
	Humidity
	Pover
	Vibrations
	etc.

These products are all of high quality and are suitable for fine-pitch applications up to 0,4 mm pitch.

		F 816 outstanding wetting