Solder Pastes with Ultra Fine Pitch Powder Particles
Wafer Bumping
These solder pastes contain very fine powder particles 15 – 25 µm (class 5 according to J-STD-006).
They are used for ultra-fine-pitch applications, e. g. printing through very narrow stencil openings (< 200 µm) or through very thin stencils (< 100 µm).
Wafer Bumping
Construction of bumps (solder balls) onto semi-conductor components (wafer = thin semi-conductor crystal discs) which are not encapsulated. Printing of solder paste is one of the lowest cost alternatives for wafer bumping. Since the encapsulated components are very small, solder pastes with ultra fine pitch powder particles are used.
