|
| <-- click big! --> |
;){kind=link}
 | Back to Home Lead Free Solder Pastes Available Alloys: SnAgCu, SnAg, SnAgBi, SnAgBiCu - Please see below for more details Alloy: SnAgCu No Clean F 640 F 640 Solder Paste series is a state-of-the-art lead free no clean solder paste that promotes wetting and minimises soldering defects. The F 640 Series exhibits minimal slump and has excellent print-after-wait performance.This formula provides superior performance on a variety of surface finishes and leaves behind a clear residue. Reflow can be accomplished in air or nitrogen. Key Benefits of F 640: - exceptional print to print consistency - excellent wetting - min. 8 hour tack and work life - very good print after wait performance - SIR 85/85 > 10E10 Ohm - constant performance at 30°C for 7days - work conditions between 20 and 32°C - Fulfils Siemens Standard accord. DIN EN 29454 Part 1 - Passes J-STD-004 Datasheet Technical Information on F 640 F 620 F 620 Solder Paste series is a lead free no clean solder paste that promotes wetting and minimizes soldering defects. The F 620 flux system is specifically optimized for Sn/Ag/Cu and SnAg alloy soldering. Key Benefits of F 620: · Exceptional print to print consistency · Excellent wetting · 8 hour tack and work life · Very good print after wait performance · Fulfils Siemens Norm accord. DIN EN 29454 Part 1 · Passes IPC Norm (see Trace Lab report from Apr.04) Datasheet Technical Information on F 620 Water Soluble: F 540 is a custom designed water soluble solder paste. Optimized rheology and careful chemical selection result in consistent print volume and excellent print definition. Advantages
Reflow profile Alloy: SnAg No Clean F 360 - The pastes of the F 360 series are halide-free no clean solder pastes sucessfully used in the electronics industry for many years. Advantages:
Reflow Profile (Ag35) Cleaning soldered / unsoldered F 381 - The solder pastes of the F381 Series comprise a ready-to-use homogeneous mixture with low odour characteristics, consisting of metal powders, binders, solvents, fluxes and thixotropic agents. Datasheet Water Soluble F 540 is a custom designed water soluble solder paste. Optimized rheology and careful chemical selection result in consistent print volume and excellent print definition. Advantages
Reflow profile (Ag3.5) Alloy: SnBi |
© W. C. Heraeus GmbH· Heraeusstr. 12 - 14 · 63450 Hanau, Germany
Phone: +49 (0) 61 81 / 35-52 65 · Fax: +49 (0) 61 81 / 35-78 60
E-Mail: cmdinfo@heraeus.com · Internet: www.4cmd.com