<-- click big! -->
 

The high-performance solder pastes of the F 10 series are no-clean solder pastes with outstanding wetting, printing and zero hot slump.

Advantages

    • Excellent wetting to Cu, with OSP
    • Eliminates solder balling and beading
    • No slump
    • Outstanding printing with brick-like prints
    • Very long stencil life
    • Compatible with manual print operations
    • Zero hot slump
    • Wide process window
Do you require further information about F 10?
Datasheet
Reflow Profile ( Sn62 / Sn63 )


© W. C. Heraeus GmbH· Heraeusstr. 12 - 14 · 63450 Hanau, Germany
Phone: +49 (0) 61 81 / 35-52 65 · Fax: +49 (0) 61 81 / 35-78 60
E-Mail: cmdinfo@heraeus.com · Internet: www.4cmd.com